| PCB Cu Thickness + Plating |
| Out Layer Cu Thickness | 1 - 6OZ |
| Inner Layer Cu Thickness | 0.5 - 4OZ |
| Cu Thickness of PTH | 20UM ≤ Average ≤ 25UM |
| Min: 18UM |
| HASL with Lead | Tin 63% Lead 37% |
| HASL Free Lead | 7UM ≤ Surface Thickness ≤ 12UM |
| Thick Gold Plating | Ni Thickness: 3 - 5UM ( 120u" - 200u" ) |
| Gold Thickness: 0.025 - 1.27UM ( 1u" - 50u" ) |
| Immersion Gold | Ni Thckness: 3 - 5UM ( 120u" - 200u" ) |
| Gold Thickness: 0.025 - 0.15UM ( 1u" - 3u" ) |
| Immersion Silver | Ag Thickness: 0.15- 0.75 UM ( 6u" - 30u" ) |
| Gold Finger | Ni Thickness: 3 - 5UM ( 120u" - 160u" ) |
| Gold Thickness: 0.025 - 1.51UM ( 1u" - 60u" ) |
| U940 PCB Pattern Limit Capability | |
| Min Width | 0.075MM ( 3 mil ) |
| Min Trace | 0.075MM ( 3 mil ) |
| Min Width of Ring ( Inner Layer ) | 0.15MM ( 6 mil ) |
| Min Width of Ring ( Out Layer ) | 0.1MM ( 4 mil ) |
| Min Solder Bridge | 0.1MM ( 4 mil ) |
| Min Height of Legend | 0.7MM ( 28 mil ) |
| Min Width of Legend | 0.15MM ( 6 mil ) |
Reference - Our Production Capability for Rigid PCB
1) Layer: 1-18 Layers
2) Board finished thickness: 0.21mm-7.0mm
3) Material: FR-4, CEM-1,CEM-3, High TG, FR4 Halogen Free,Rogers
4) Max. finished board size: 23 × 25 ( 580mm×900mm )
5) Min. drilled hole size: 3mil (0.075mm)
6) Min. Line width: 3mil (0.075mm)
Min.Line spacing:3mil (0.075mm)
7) Surface finish/treatment : HASL / HASL lead free,HAL, Chemical tin,Chemical Gold, Immersion Silver/Gold,OSP,Gold plating
8) Copper thickness: 0.5-7.0 OZ
9) Solder mask color: green/yellow/black/white/red/blue
10) Copper thickness in hole: >25.0 um (>1mil)
11)Inner packing: Vacuum packing / Plastic bag
Outer packing: Standard carton packing
12) Shape tolerance: ±0.13
Hole tolerance: PTH: ±0.076 NPTH: ±0.05
13) Certificate: UL, ISO 9001, ISO 14001
14) Special requirements: Buried and blind vias+controlled impedance +BGA
15) Profiling: Punching, Routing, V-CUT, Beveling
16) Provides OEM services to all sorts of printed circuit board assembly as well as electronic encased products
PCB Capacity
| Item | Capability---Technology |
| Standard | IPC-A-610 E Class II-III |
| Laminate/Base Material | FR-4 / PI (FPC) / High TG FR-4 / Halogen Free material/Rogers/Arlon/ Taconic/Teflon/CEM-3/PTFE/Aluminum /BT |
| Layers | 1-18 |
| Finised inner/outer copper thickness | 1-6 OZ |
| Board Thinkness | 0.2-5.0mm |
| | Mechanical hole: 0.15mm |
| Laser hole: 0.1mm |
| Min line width/space | 0.075mm/0.075mm |
| Min line Gap | +/-10% |
| Aspect Ratio | 12:1 |
| Controlled Impedance | <= +/-10% |
| Solder Mask Color | Green,Blue,Black,White,Yellow,Red,Grey,Purple etc.. |
| Outline profile | Rout/ V-cut/ Bridge/ Stamp hole |
| Surface treatment | HASL, HASL lead free, Immersion Gold,ENEPIG, Immersion Tin, Immersion Silver, Hard gold, Flash gold, OSP... |
| Tolerance of dimension size | +/-0.1mm |
| Capacity | 35000sq/Month |
| CAM Capability | 40 item |
PCB Photos
